Invention Grant
- Patent Title: Method of forming epitaxial SiC using XPS characterization
- Patent Title (中): 使用XPS表征形成外延SiC的方法
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Application No.: US11586680Application Date: 2006-10-26
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Publication No.: US07678671B2Publication Date: 2010-03-16
- Inventor: Akinori Seki , Yukari Tani , Noriyoshi Shibata
- Applicant: Akinori Seki , Yukari Tani , Noriyoshi Shibata
- Applicant Address: JP Toyota-shi, Aichi-ken JP Nagoya
- Assignee: Toyota Jidosha Kabushiki Kaisha,Japan Fine Ceramics Center
- Current Assignee: Toyota Jidosha Kabushiki Kaisha,Japan Fine Ceramics Center
- Current Assignee Address: JP Toyota-shi, Aichi-ken JP Nagoya
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
- Priority: JP2005-312628 20051027
- Main IPC: H01L31/0312
- IPC: H01L31/0312

Abstract:
A semiconductor material having a stepwise surface structure of (0001)-plane terraces and (11-2n)-plane steps [n≧0] on the SiC substrate, a semiconductor device using the same and a method of producing the semiconductor material in which a carbon-rich surface is formed on the SiC substrate prior to epitaxial growth of an SiC crystal, the carbon-rich surface satisfies the ratio R=(I284.5/I282.8)>0.2, wherein I282.8 (ISiC) is an integrated intensity of a C1s signal having a peak at the binding energy relating to stoichiometric SiC (in the region of 282.8 eV), and I284.5 (IC) is an integrated intensity of a C1s signal having a peak at the binding energy relating to graphite, SiCx (x>1), or SiyCH1-y (y
Public/Granted literature
- US20070096109A1 Semiconductor material, production method thereof and semiconductor device Public/Granted day:2007-05-03
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