Ultraviolet assisted pore sealing of porous low k dielectric films

Invention Grant

US07678682B2 Ultraviolet assisted pore sealing of porous low k dielectric films 失效

Title translation: 多孔低k介电膜的紫外辅助孔密封

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Patent Title: Ultraviolet assisted pore sealing of porous low k dielectric films
Patent Title (中): 多孔低k介电膜的紫外辅助孔密封
Application No.: US10987276

Application Date: 2004-11-12
Publication No.: US07678682B2

Publication Date: 2010-03-16
Inventor: Carlo Waldfried , Orlando Escorcia , Ivan Berry
Applicant: Carlo Waldfried , Orlando Escorcia , Ivan Berry
Applicant Address: US MA Beverly
Assignee: Axcelis Technologies, Inc.
Current Assignee: Axcelis Technologies, Inc.
Current Assignee Address: US MA Beverly
Agency: Cantor Colburn LLP
Main IPC: H01L21/8238
IPC: H01L21/8238 ; H01L21/76 ; H01L21/4763

Ultraviolet assisted pore sealing of porous low k dielectric films

Abstract:

Processes for sealing porous low k dielectric film generally comprises exposing the porous surface of the porous low k dielectric film to ultraviolet (UV) radiation at intensities, times, wavelengths and in an atmosphere effective to seal the porous dielectric surface by means of carbonization, oxidation, and/or film densification. The surface of the surface of the porous low k material is sealed to a depth less than or equal to about 20 nanometers, wherein the surface is substantially free of pores after the UV exposure.

Abstract(Chinese):

用于密封多孔低k电介质膜的方法通常包括将多孔低k电介质膜的多孔表面暴露于强度，时间，波长和大气中的紫外线（UV）辐射，有效地通过碳化，氧化来密封多孔电介质表面，和/或膜致密化。多孔低k材料的表面的表面被密封到小于或等于约20纳米的深度，其中在UV暴露后该表面基本上没有孔。

Public/Granted literature

US20060105566A1 Ultraviolet assisted pore sealing of porous low k dielectric films Public/Granted day:2006-05-18

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Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70	.由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理；集成电路器件或其特殊部件的制造（由预制电组件组成的组装件的制造入H05K3/00，H05K13/00）
H01L21/77	..在公共衬底中或上面形成的由许多固态元件或集成电路组成的器件的制造或处理（电可编程只读存储器或其多步骤的制造方法入H01L27/115）
H01L21/78	...把衬底连续地分成多个独立的器件（改变表面物理特性或者半导体形状的切割入H01L21/304）
H01L21/82	....制造器件，例如每一个由许多元件组成的集成电路
H01L21/822	.....衬底是采用硅工艺的半导体的（H01L21/8258优先）
H01L21/8232	......场效应工艺
H01L21/8234	.......MIS工艺
H01L21/8238	........互补场效应晶体管，例如CMOS