Invention Grant
- Patent Title: Flexible substrate with electronic devices formed thereon
- Patent Title (中): 柔性基板，其上形成有电子器件
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Application No.: US11461080Application Date: 2006-07-31
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Publication No.: US07678701B2Publication Date: 2010-03-16
- Inventor: Timothy J. Tredwell , Roger S. Kerr
- Applicant: Timothy J. Tredwell , Roger S. Kerr
- Applicant Address: US NY Rochester
- Assignee: Eastman Kodak Company
- Current Assignee: Eastman Kodak Company
- Current Assignee Address: US NY Rochester
- Agent Nelson Adrian Blish
- Main IPC: H01L21/302
- IPC: H01L21/302
Abstract:
A method of manufacturing an electronic device (10) provides a substrate (20) that has a plastic material. A particulate material (16) is embedded in at least one surface of the substrate. A layer of thin-film semiconductor material is deposited onto the substrate (20).
Public/Granted literature
- US20080026581A1 FLEXIBLE SUBSTRATE WITH ELECTRONIC DEVICES FORMED THEREON Public/Granted day:2008-01-31
Information query
IPC分类:
