Invention Grant
- Patent Title: Large area circuitry using appliqués
- Patent Title (中): 使用贴花的大面积电路
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Application No.: US11612576Application Date: 2006-12-19
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Publication No.: US07678997B2Publication Date: 2010-03-16
- Inventor: Diane C. Rawlings
- Applicant: Diane C. Rawlings
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: McNees Wallace & Nurick, LLC
- Main IPC: H01B7/08
- IPC: H01B7/08
Abstract:
An appliqué for forming a surface coating to a substrate is disclosed. The appliqué contains a sectioned metal foil that provides a large area electrical circuit for connecting electrical devices. The appliqué may provide additional functions including lightning strike protection. The substrate may be an aircraft surface.
Public/Granted literature
- US20080142238A1 LARGE AREA CIRCUITRY USING APPLIQUES Public/Granted day:2008-06-19
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