Invention Grant
- Patent Title: Keypad assembly for electronic device
- Patent Title (中): 电子设备键盘组件
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Application No.: US12345361Application Date: 2008-12-29
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Publication No.: US07679015B2Publication Date: 2010-03-16
- Inventor: Chih-Wei Cheng
- Applicant: Chih-Wei Cheng
- Applicant Address: TW Tu-Cheng, Taipei County
- Assignee: Chi Mei Communication Systems, Inc.
- Current Assignee: Chi Mei Communication Systems, Inc.
- Current Assignee Address: TW Tu-Cheng, Taipei County
- Agent D. Austin Bonderer
- Priority: CN200810300089 20080114
- Main IPC: H01H9/00
- IPC: H01H9/00

Abstract:
A keypad assembly includes a pressing surface layer, a pattern layer, an elastic layer, a light guiding layer, and a pressing bottom layer. The pattern layer is under the pressing surface layer. The elastic layer is located between and interlocks the pattern layer and the light guiding layer by adhesive. The pressing bottom layer adheres to the light guiding layer. The keypad assembly has an ideal appearance by lights collection of the light guiding layer. User can feel comfortable when pressing the keypad assembly because of the elastic layer's buffering effect.
Public/Granted literature
- US20090178907A1 KEYPAD ASSEMBLY FOR ELECTRONIC DEVICE Public/Granted day:2009-07-16
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