Invention Grant
- Patent Title: Substrate structures and fabrication methods thereof
- Patent Title (中): 基板结构及其制造方法
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Application No.: US11625791Application Date: 2007-01-22
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Publication No.: US07679081B2Publication Date: 2010-03-16
- Inventor: Lih-Hsiung Chan , Ming-Chun Hsiao , Wei-Ling Lin , Gary Wei
- Applicant: Lih-Hsiung Chan , Ming-Chun Hsiao , Wei-Ling Lin , Gary Wei
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Quintero Law Office
- Priority: TW95131702A 20060829
- Main IPC: H01L35/24
- IPC: H01L35/24 ; H01L51/00

Abstract:
Substrate structures and fabrication methods thereof. A substrate structure includes a bendable substrate and an inorganic electrode structure on the bendable structure, wherein the inorganic electrode structure includes a conductive layer or a semiconductor layer. The inorganic electrode structure includes carbon nanotubes, carbon nanofibers, a nanolinear material, or a micro-linear material. The bendable substrate includes polyethylene (PE), polyimide (PI), polyvinyl alcohol (PVA), or polymethyl methacrylate (PMMA).
Public/Granted literature
- US20080054255A1 SUBSTRATE STRUCTURES AND FABRICATION METHODS THEREOF Public/Granted day:2008-03-06
Information query
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