Invention Grant
- Patent Title: Housing for an electromagnetic radiation emitting optoelectronic component, component and method of making a housing or a component
- Patent Title (中): 用于电磁辐射发射光电子部件的壳体，制造壳体或部件的部件和方法
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Application No.: US11526550Application Date: 2006-09-25
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Publication No.: US07679100B2Publication Date: 2010-03-16
- Inventor: Lukas Schwenkschuster , Martin Wüller , Joachim Reill , Moritz Engl
- Applicant: Lukas Schwenkschuster , Martin Wüller , Joachim Reill , Moritz Engl
- Applicant Address: DE Regensburg DE Lippstadt
- Assignee: Osram Opto Semiconductors GmbH,Hella KGAA Hueck & Co.
- Current Assignee: Osram Opto Semiconductors GmbH,Hella KGAA Hueck & Co.
- Current Assignee Address: DE Regensburg DE Lippstadt
- Agency: Fish & Richardson P.C.
- Priority: DE102005047153 20050930; DE102005059524 20051213
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
A housing for an electromagnetic radiation emitting optoelectronic component is specified. The housing comprises a housing base body provided with a recess in which at least one chip mounting surface is disposed. At least one outer surface of the housing base body, disposed on an emission side of the housing and adjoining the recess, is provided with a baffle layer suitable for screening an electromagnetic radiation. An electromagnetic radiation emitting component provided with such a housing and a method of making a corresponding housing or component are also specified.
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