Invention Grant
- Patent Title: Vertical type semiconductor device and manufacturing method of the device
- Patent Title (中): 垂直型半导体器件及其制造方法
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Application No.: US11937090Application Date: 2007-11-08
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Publication No.: US07679104B2Publication Date: 2010-03-16
- Inventor: Yoshihiro Sato , Sadahiro Kato , Masayuki Iwami , Hitoshi Sasaki , Shinya Ootomo , Yuki Niiyama
- Applicant: Yoshihiro Sato , Sadahiro Kato , Masayuki Iwami , Hitoshi Sasaki , Shinya Ootomo , Yuki Niiyama
- Applicant Address: JP Tokyo
- Assignee: The Furukawa Electric Co., Ltd.
- Current Assignee: The Furukawa Electric Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2006-304193 20061109; JP2006-305869 20061110; JP2007-077580 20070323
- Main IPC: H01L29/267
- IPC: H01L29/267

Abstract:
A vertical semiconductor element comprises: an electro-conductive substrate; a GaN layer, as a nitride compound semiconductor layer, which is selectively grown as a convex shape on one surface of the electro-conductive substrate through a buffer layer; a source electrode as a first electrode formed on the GaN layer; and a drain electrode as a second electrode formed on another surface of the electro-conductive substrate.
Public/Granted literature
- US20080142837A1 VERTICAL TYPE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE DEVICE Public/Granted day:2008-06-19
Information query
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