Invention Grant
- Patent Title: Method of removing refractory metal layers and of siliciding contact areas
- Patent Title (中): 去除难熔金属层和硅化接触区域的方法
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Application No.: US11669500Application Date: 2007-01-31
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Publication No.: US07679149B2Publication Date: 2010-03-16
- Inventor: Audrey Beckert , Matthias Goldbach , Clemens Fitz
- Applicant: Audrey Beckert , Matthias Goldbach , Clemens Fitz
- Applicant Address: DE Munich
- Assignee: Qimonda AG
- Current Assignee: Qimonda AG
- Current Assignee Address: DE Munich
- Agency: Dicke, Billig & Czaja, PLLC
- Priority: DE102006004396 20060131
- Main IPC: H01L29/76
- IPC: H01L29/76

Abstract:
A method of formation of contacts with cobalt silicide since is disclosed. For example, after siliciding with the SOM solution, both unreacted sections of the deposition layer including, for example, cobalt as initial layer for the siliciding and an oxidation protection layer including titanium and deposited by means of cathode beam sputtering, for instance, may be removed rapidly and with high selectivity relative to the cobalt silicide and other, densified metal structures and metal layers.
Public/Granted literature
- US20080029835A1 Method of Removing Refractory Metal Layers and of Siliciding Contact Areas Public/Granted day:2008-02-07
Information query
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