Invention Grant
- Patent Title: Micromechanical device and method for manufacturing a micromechanical device
- Patent Title (中): 微机械装置及其制造方法
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Application No.: US11668743Application Date: 2007-01-30
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Publication No.: US07679151B2Publication Date: 2010-03-16
- Inventor: Karlheinz Mueller , Bernhard Winkler
- Applicant: Karlheinz Mueller , Bernhard Winkler
- Applicant Address: DE Munich
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Munich
- Agency: Eschweiler & Associates, LLC
- Priority: DE102006004209 20060130
- Main IPC: H01L29/06
- IPC: H01L29/06

Abstract:
In a method for manufacturing a micromechanical device having a region for forming an integrated circuit, at first a first layer is produced on a deeper-lying part in the substrate. Subsequently, a membrane layer is produced on the first layer and at least one channel completely penetrating the membrane layer is introduced in the membrane layer. After that, a region of the first layer below the membrane layer is removed to form a cavity. Finally, the channel is sealed and a planar surface is formed.
Public/Granted literature
- US20070184624A1 Micromechanical Device And Method For Manufacturing A Micromechanical Device Public/Granted day:2007-08-09
Information query
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