Invention Grant
US07679152B2 Micromechanical device, micromechanical system, apparatus for adjusting sensitivity of a micromechanical device, method for producing a micromechanical device
有权
微机械装置，微机械系统，用于调整微机械装置的灵敏度的装置，用于制造微机械装置的方法
- Patent Title: Micromechanical device, micromechanical system, apparatus for adjusting sensitivity of a micromechanical device, method for producing a micromechanical device
- Patent Title (中): 微机械装置，微机械系统，用于调整微机械装置的灵敏度的装置，用于制造微机械装置的方法
-
Application No.: US12106417Application Date: 2008-04-21
-
Publication No.: US07679152B2Publication Date: 2010-03-16
- Inventor: Thomas Klose , Thomas Graβhoff
- Applicant: Thomas Klose , Thomas Graβhoff
- Applicant Address: DE Munich
- Assignee: Fraunhofer-Gesellschaft zur Foerderung der andewandten Forschung e.V.
- Current Assignee: Fraunhofer-Gesellschaft zur Foerderung der andewandten Forschung e.V.
- Current Assignee Address: DE Munich
- Agency: Keating & Bennett, LLP
- Priority: DE102007021920 20070510
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/00 ; G02B26/08
Abstract:
A micromechanical device has a layer; at least a first slot formed in the layer to define a first oscillation element oscillatably suspended via a first spring portion of the layer; and at least a second slot formed in the layer to define a second oscillation element oscillatably suspended via a second spring portion of the layer, wherein a trench is formed in the spring portion pair in a main surface of the layer, wherein a resonance frequency of the first oscillation element is different from that of the second oscillation element, and the first and second spring portions and the trench are formed such that, in an anisotropic lateral material removal and/or addition of the first and second spring portions, a ratio of a relative change of the resonance frequency of the second oscillation element to that of the first oscillation element ranges from 0.8 to 1.2.
Public/Granted literature
Information query
IPC分类:
