Invention Grant
- Patent Title: Integrated current sensor package
- Patent Title (中): 集成电流传感器封装
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Application No.: US11311517Application Date: 2005-12-19
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Publication No.: US07679162B2Publication Date: 2010-03-16
- Inventor: Timothy J. Dupuis , John Pavelka
- Applicant: Timothy J. Dupuis , John Pavelka
- Applicant Address: US TX Austin
- Assignee: Silicon Laboratories Inc.
- Current Assignee: Silicon Laboratories Inc.
- Current Assignee Address: US TX Austin
- Agency: Zagorin O'Brien Graham LLP
- Main IPC: H01L29/00
- IPC: H01L29/00 ; H01L23/02 ; H01L23/34
Abstract:
An integrated current sensor package includes an integrated circuit having a coil in a metal layer of the circuit. A wire is placed close enough to the coil such that the coil and the wire are inductively coupled with each other.
Public/Granted literature
- US20070139066A1 Integrated current sensor package Public/Granted day:2007-06-21
Information query
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