Invention Grant
- Patent Title: Printed circuit board with differential pair arrangement
- Patent Title (中): 印刷电路板与差分对布置
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Application No.: US11309266Application Date: 2006-07-21
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Publication No.: US07679168B2Publication Date: 2010-03-16
- Inventor: Sheng-Yun Shu
- Applicant: Sheng-Yun Shu
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Agent Wei Te Chung
- Priority: CN200510036572 20050812
- Main IPC: H01L23/58
- IPC: H01L23/58 ; H01L23/62

Abstract:
A printed circuit board (PCB) with a differential pair arrangement includes a mounting area for receiving a chip, a plurality of first pads located near one edge of the mounting area, a plurality of second pads located near an opposite edge of the mounting area, the first pads and the second pads are arranged for receiving pins of the chip. A pair of vias is used for connecting layers of the PCB. The second pads are located between the vias and the mounting area. A differential pair includes two signal traces, one of the signal traces is connected to one of the first pads and routed to one of the vias through the mounting area, the other of the signal traces is routed through the mounting area and connected to one of the second pads and then routed to the other one of the vias.
Public/Granted literature
- US20070075432A1 PRINTED CIRCUIT BOARD WITH DIFFERENTIAL PAIR ARRANGEMENT Public/Granted day:2007-04-05
Information query
IPC分类: