Invention Grant
- Patent Title: Stacked integrated circuit leadframe package system
- Patent Title (中): 堆叠式集成电路引线框封装系统
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Application No.: US12236227Application Date: 2008-09-23
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Publication No.: US07679169B2Publication Date: 2010-03-16
- Inventor: Choong Bin Yim
- Applicant: Choong Bin Yim
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agent Mikio Ishimaru
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/48
Abstract:
A stacked integrated circuit leadframe package system including forming a leadframe, packaging a top integrated circuit on a one side of the leadframe, packaging a bottom integrated circuit on an opposite side of the leadframe, and forming external electrical interconnects on the leadframe.
Public/Granted literature
- US20090026597A1 STACKED INTEGRATED CIRCUIT LEADFRAME PACKAGE SYSTEM Public/Granted day:2009-01-29
Information query
IPC分类:
