Invention Grant
- Patent Title: Stacked mounting structure
- Patent Title (中): 堆叠安装结构
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Application No.: US11639045Application Date: 2006-12-14
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Publication No.: US07679196B2Publication Date: 2010-03-16
- Inventor: Takanori Sekido , You Kondoh
- Applicant: Takanori Sekido , You Kondoh
- Applicant Address: JP Tokyo
- Assignee: Olympus Corporation
- Current Assignee: Olympus Corporation
- Current Assignee Address: JP Tokyo
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Priority: JP2005-370157 20051222
- Main IPC: H01L29/41
- IPC: H01L29/41 ; H05K7/02
Abstract:
A stacked mounting structure includes at least two substrates namely a first substrate on which a first protruding electrode is formed and a second substrate on which a second protruding electrode is formed, and an intermediate substrate which is disposed between the first substrate and the second substrate, and which connects the first substrate and the second substrate by leaving a predetermined gap between the first substrate and the second substrate. Mounted components are disposed in the gap between the first substrate and the second substrate. The first protruding electrode and the second protruding electrode are connected in an opening which is provided in the intermediate substrate.
Public/Granted literature
- US20070164444A1 Stacked mounting structure Public/Granted day:2007-07-19
Information query
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