Invention Grant
- Patent Title: Device package
- Patent Title (中): 设备包
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Application No.: US11312880Application Date: 2005-12-20
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Publication No.: US07679201B2Publication Date: 2010-03-16
- Inventor: Ronald Frederick Barbee , Glenn Robertson , Robert Peene
- Applicant: Ronald Frederick Barbee , Glenn Robertson , Robert Peene
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman, Lundberg & Woessner, P.A.
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52
Abstract:
A package includes a device and a package substrate. The device includes a plurality of electrical pads, and has a periphery that defines a footprint. The package substrate, further includes a first substrate surface to which the device is attached, a second substrate surface, and a set of electrical contacts attached to the second substrate surface.
Public/Granted literature
- US20070138611A1 Device package Public/Granted day:2007-06-21
Information query
IPC分类:
