Invention Grant
- Patent Title: Probe card for inspecting electric properties of an object
- Patent Title (中): 用于检查物体的电气特性的探针卡
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Application No.: US11822577Application Date: 2007-07-09
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Publication No.: US07679385B2Publication Date: 2010-03-16
- Inventor: Takashi Amemiya , Syuichi Tsukada
- Applicant: Takashi Amemiya , Syuichi Tsukada
- Applicant Address: JP JP
- Assignee: Tokyo Electron Limited,JSR Corporation
- Current Assignee: Tokyo Electron Limited,JSR Corporation
- Current Assignee Address: JP JP
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
- Priority: JP2006-189723 20060710; JP2007-176048 20070704
- Main IPC: G01R31/02
- IPC: G01R31/02

Abstract:
In the present invention, an inspection contact structure is attached to a lower surface side of a circuit board of a probe card. The inspection contact structure has a silicon substrate, and sheets attached to upper and lower surfaces of the silicon substrate. Each of the sheets is elastic and has conductive portions in a projecting shape. The silicon substrate is formed with current-carrying paths passing through the substrate in a vertical direction so that the conductive portions of the sheets and the current-carrying paths of the silicon substrate are in contact with each other. The upper and lower sheets are fixed to the silicon substrate, and the sheet on the upper surface is fixed to a circuit board.
Public/Granted literature
- US20080007280A1 Probe card Public/Granted day:2008-01-10
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