Invention Grant
- Patent Title: Branching filter package
- Patent Title (中): 分支过滤器包装
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Application No.: US11979063Application Date: 2007-10-30
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Publication No.: US07679472B2Publication Date: 2010-03-16
- Inventor: Wataru Ohashi , Hajime Shimamura , Tomokazu Komazaki , Yoshiaki Fujita
- Applicant: Wataru Ohashi , Hajime Shimamura , Tomokazu Komazaki , Yoshiaki Fujita
- Applicant Address: JP Tokyo
- Assignee: Oki Semiconductor Co., Ltd.
- Current Assignee: Oki Semiconductor Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Venable LLP
- Agent Michael A. Sartori; Kyle D. Petaja
- Priority: JP10-160088 19980609; JP11-149959 19990528
- Main IPC: H03H9/72
- IPC: H03H9/72
Abstract:
A branching filter package has a SAW filter chip housing area which houses a piezo electric base, on which a transmitting SAW filter and a receiving SAW filter having a different frequency passing band with each other, are formed, and an impedance matching circuit and a branching circuit for the transmitting SAW filter and the receiving SAW filter.
Public/Granted literature
- US20080129413A1 Branching filter package Public/Granted day:2008-06-05
Information query
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