Invention Grant
- Patent Title: Fusible link unit
- Patent Title (中): 易熔链接单元
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Application No.: US11783147Application Date: 2007-04-06
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Publication No.: US07679484B2Publication Date: 2010-03-16
- Inventor: Shinya Onoda , Toshiharu Kudo
- Applicant: Shinya Onoda , Toshiharu Kudo
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2006-139997 20060519
- Main IPC: H01H85/30
- IPC: H01H85/30 ; H01H85/02

Abstract:
A fusible link unit includes a housing and two fuse circuit bodies overlapped with each other and received in the housing in a thickness direction of the housing. A coupling plate and terminals connected to each other via fuse elements integrally forms the fuse circuit body. An opening is formed on an outer wall of the housing. The housing includes a cover made of transparent material and having a U-shaped section for covering the opening. The cover integrally includes a projection projecting to an inside of the housing on a sidewall of the cover. The projection includes a reflecting wall sloping on the sidewall in a thickness direction of the housing 7.
Public/Granted literature
- US20070268107A1 Fusible link unit Public/Granted day:2007-11-22
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