Invention Grant
- Patent Title: Solid-state imaging element and solid-state imaging device
- Patent Title (中): 固态成像元件和固态成像装置
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Application No.: US11558227Application Date: 2006-11-09
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Publication No.: US07679662B2Publication Date: 2010-03-16
- Inventor: Sadamu Suizu , Masaaki Takayama
- Applicant: Sadamu Suizu , Masaaki Takayama
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sonnenschein Nath & Rosenthal LLP
- Priority: JPP2005-327587 20051111
- Main IPC: H04N5/335
- IPC: H04N5/335

Abstract:
Disclosed herein is a solid-state imaging element which includes a plurality of drive signal inputs, a plurality of bus lines, and a plurality of vertical transfer register electrodes. In the solid-state imaging element, a charge accumulated in light-receiving elements in a pixel region is vertically transferred by the drive signals input to the electrodes. Each of the electrodes has a contact part connected to the second contact and having a width smaller than a width of the electrodes in the pixel region, and a blank region is formed between predetermined adjacent two of the contact parts so that a width of the blank region is larger than a distance between respective two of the contact parts other than the predetermined adjacent two of the contact parts. The first contact is disposed on the blank region.
Public/Granted literature
- US20070115381A1 SOLID-STATE IMAGING ELEMENT AND SOLID-STATE IMAGING DEVICE Public/Granted day:2007-05-24
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