A camera module package comprises an image sensor having a light receiving section formed in the central portion of the upper surface thereof and a plurality of bumps formed around the light receiving section; an FPCB that is closely bonded to the image sensor by a flip chip, the FPCB having a plurality of via holes perforated at bonding positions corresponding to the bumps such that the bumps and the via holes are closely bonded to each other one to one; and an optical unit having a housing received on the FPCB and a lens barrel screwed to the central portion of the housing.