Invention Grant
- Patent Title: Socket
- Patent Title (中): 插座
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Application No.: US11144863Application Date: 2005-06-03
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Publication No.: US07679673B2Publication Date: 2010-03-16
- Inventor: Akira Takekuma , Yoshifumi Yamaoka
- Applicant: Akira Takekuma , Yoshifumi Yamaoka
- Applicant Address: SG Singapore
- Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.
- Current Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.
- Current Assignee Address: SG Singapore
- Priority: JP2004-174944 20040614
- Main IPC: H04N5/225
- IPC: H04N5/225
Abstract:
A socket in which a light-emitting diode can be attached and detached as needed close to the structure for holding a camera module. Socket comprises a spring contact part for contacting the leads or electrodes of the light-emitting diode, and an anchor for anchoring such that the direction of a dome section has a predetermined relationship with the camera module.
Public/Granted literature
- US20050275748A1 Socket Public/Granted day:2005-12-15
Information query
