Invention Grant
- Patent Title: Flip chip quantum well modulator
- Patent Title (中): 倒装芯片量子阱调制器
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Application No.: US12171803Application Date: 2008-07-11
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Publication No.: US07679805B2Publication Date: 2010-03-16
- Inventor: Mahyar Dadkhah , Tony Maryfield , Thomas Davidson
- Applicant: Mahyar Dadkhah , Tony Maryfield , Thomas Davidson
- Applicant Address: US CA San Diego
- Assignee: Cubic Corporation
- Current Assignee: Cubic Corporation
- Current Assignee Address: US CA San Diego
- Agency: Townsend and Townsend and Crew LLP
- Main IPC: G02F1/03
- IPC: G02F1/03 ; G02F1/00 ; H01S3/10 ; H01S3/04 ; H01L31/00

Abstract:
A quantum well modulator configured to absorb or transmit light depending on an applied voltage is provided according to various embodiments. The quantum well modulator may include a substrate, a p-type and n-type semiconductor layers as well as a quantum well layer, each of which are deposited above the substrate. The substrate may be configured to filter light incident thereon, wherein the substrate does not include a reflective surface. The flip-chip quantum well modulator may be configured to substantially absorb light received through the substrate when a first voltage is applied. The flip-chip quantum well modulator may be configured to substantially transmit light received through the substrate when a second voltage is applied.
Public/Granted literature
- US20090034049A1 Flip Chip Quantum Well Modulator Public/Granted day:2009-02-05
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