Invention Grant
- Patent Title: Semiconductor device and method for determining fuse state
- Patent Title (中): 用于确定熔丝状态的半导体器件和方法
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Application No.: US11806553Application Date: 2007-06-01
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Publication No.: US07679871B2Publication Date: 2010-03-16
- Inventor: Norio Okada , Takehiro Ueda
- Applicant: Norio Okada , Takehiro Ueda
- Applicant Address: JP Kanagawa
- Assignee: NEC Electronics Corporation
- Current Assignee: NEC Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Young & Thompson
- Priority: JP2006-157604 20060606
- Main IPC: H01L29/00
- IPC: H01L29/00

Abstract:
A semiconductor device includes a semiconductor substrate, a fuse which comprises a conductive material and is formed on a semiconductor substrate, a contacting target conductor region which is placed around the fuse on the semiconductor substrate and formed so as to make electrical contact with the fuse through the conductive material constituting the fuse when a process for cutting the fuse is carried out, and a determination unit which detects whether or not the fuse is electrically disconnected, and detects whether or not the contacting target conductor region and the fuse are electrically connected, and determines that the fuse is in a cut state when electrical disconnection of said fuse is detected or electrical connection between said contacting target conductor region and said fuse is detected.
Public/Granted literature
- US20070278617A1 Semiconductor device and method for determining fuse state Public/Granted day:2007-12-06
Information query
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