Invention Grant
- Patent Title: Electronic assembly cooling
- Patent Title (中): 电子组件散热
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Application No.: US12019712Application Date: 2008-01-25
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Publication No.: US07679917B2Publication Date: 2010-03-16
- Inventor: Joseph F. Deck , Bradley L. Hunter , Michael B. Nussbaum , Steven D. Owen
- Applicant: Joseph F. Deck , Bradley L. Hunter , Michael B. Nussbaum , Steven D. Owen
- Agency: Bose Corporation
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28F7/00 ; H01L23/34
Abstract:
An electronic assembly including a first heat producing device mounted on a first outer surface of a first portion of a circuit board. The first portion can deflect upwardly and downwardly relative to other portions of the circuit board. A first force element urges the first heat producing device against a heat sink. The force exerted by the first force element is variable with respect to time.
Public/Granted literature
- US20080186681A1 ELECTRONIC ASSEMBLY COOLING Public/Granted day:2008-08-07
Information query
