Invention Grant
- Patent Title: LED element and printed circuit board with the same
- Patent Title (中): LED元件和印刷电路板相同
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Application No.: US12126367Application Date: 2008-05-23
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Publication No.: US07679918B2Publication Date: 2010-03-16
- Inventor: Jongdae Kim
- Applicant: Jongdae Kim
- Applicant Address: CN Beijing
- Assignee: Beijing Boe Optoelectronics Technology Co., Ltd.
- Current Assignee: Beijing Boe Optoelectronics Technology Co., Ltd.
- Current Assignee Address: CN Beijing
- Agency: Ladas & Parry LLP
- Priority: CN200710122585 20070927
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F21V29/00

Abstract:
Disclosed is a printed circuit board (PCB) comprising at least one light emitting diode (LED) element and a PCB body. The LED comprises a heat sink, a light emitting body and two base feet, each base foot comprising a support portion for supporting the light emitting body, an engaging portion and a connecting portion for connecting the support portion to the engaging portion, and the heat sink is disposed under the support portion. The PCB body comprises a first recess portion for disposing the heat sink to increase heat dissipation of the heat sink and two second recess portions for receiving the engaging portions of the base feet to increase heat dissipation of the base feet.
Public/Granted literature
- US20090086438A1 LED ELEMENT AND PRINTED CIRCUIT BOARD WITH THE SAME Public/Granted day:2009-04-02
Information query