Invention Grant
- Patent Title: Optical waveguide chip and method of manufacturing the same
- Patent Title (中): 光波导芯片及其制造方法
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Application No.: US11587143Application Date: 2005-04-21
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Publication No.: US07680366B2Publication Date: 2010-03-16
- Inventor: Takafumi Yokino , Katsumi Shibayama
- Applicant: Takafumi Yokino , Katsumi Shibayama
- Applicant Address: JP Hamamatsu-shi, Shizuoka
- Assignee: Hamamatsu Photonics K.K.
- Current Assignee: Hamamatsu Photonics K.K.
- Current Assignee Address: JP Hamamatsu-shi, Shizuoka
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2004-127150 20040422
- International Application: PCT/JP2005/007631 WO 20050421
- International Announcement: WO2005/103777 WO 20051103
- Main IPC: G02B6/12
- IPC: G02B6/12

Abstract:
The present invention relates to an optical waveguide chip, etc., having a structure for effectively avoiding or suppressing peeling of an optical waveguide layer in a process of cutting a wafer. The optical waveguide chip comprises a substrate having a main surface, and an optical waveguide layer formed on the main surface of the substrate. The optical waveguide layer comprises a cladding portion and a core portion that is disposed inside the cladding portion and that has a higher refractive index than the cladding portion, and at least one of side surfaces of the optical waveguide layer is positioned at a predetermined distance toward a center of the main surface from an edge of the main surface. This arrangement includes an arrangement having a thin film portion at a peripheral region that includes the edge of the main surface. In the case that the optical waveguide layer has the thin film portion at its periphery, the optical waveguide layer has a side surface that coincide with the side surface of the substrate including the edge of the main surface and a side surface that is separated by a predetermined distance from edge of the main surface. By this arrangement, when cutting a wafer into chip units, even if chipping occurs at an edge of the main surface of the substrate to be cut, peeling of the optical waveguide layer, formed on the substrate, is suppressed effectively.
Public/Granted literature
- US20080212919A1 Optical Waveguide Chip And Method Of Manufacturing The Same Public/Granted day:2008-09-04
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