Invention Grant
- Patent Title: Optoelectronic integrated circuit board and communications device using the same
- Patent Title (中): 光电集成电路板和通信设备使用相同
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Application No.: US11719319Application Date: 2005-11-16
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Publication No.: US07680367B2Publication Date: 2010-03-16
- Inventor: Yasunobu Matsuoka , Masato Shishikura
- Applicant: Yasunobu Matsuoka , Masato Shishikura
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2004-332673 20041117
- International Application: PCT/JP2005/020997 WO 20051116
- International Announcement: WO2006/054569 WO 20060526
- Main IPC: G02B6/42
- IPC: G02B6/42

Abstract:
In the optical connection between multi-layered optical waveguides and photoelectric converting elements or optical waveguide array connectors formed on a substrate, the optical coupling efficiency is to be prevented from degrading due to deviation of the optical axis positions between optical elements and the optical waveguide layers that is caused by a radiation due to a beam expansion or by a deviation of positioning layers in producing the optical waveguides. There are stacked, on a substrate, optical waveguide layers, each of which comprises a clad layer and a core having a higher refractive index than the clad layer, and optical elements formed on the uppermost optical waveguide layer. The optical elements are positioned such that they correspond to the optical path conversion mirrors of the cores of the underlaying optical waveguide layer. The light transmission/reception between the optical elements and the optical path conversion mirrors of the cores of the underlaying optical waveguide layer is performed via the cores of overlying optical waveguide layer.
Public/Granted literature
- US20090080830A1 OPTOELECTRONIC INTEGRATED CIRCUIT BOARD AND COMMUNICATIONS DEVICE USING THE SAME Public/Granted day:2009-03-26
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