Invention Grant
- Patent Title: Hinge assembly and foldable electronic device using the same
- Patent Title (中): 铰链组装和使用其的可折叠电子装置
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Application No.: US12249006Application Date: 2008-10-10
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Publication No.: US07681282B2Publication Date: 2010-03-23
- Inventor: Chia-Shien Liu
- Applicant: Chia-Shien Liu
- Applicant Address: TW Tu-Cheng, Taipei County
- Assignee: Chi Mei Communication Systems, Inc.
- Current Assignee: Chi Mei Communication Systems, Inc.
- Current Assignee Address: TW Tu-Cheng, Taipei County
- Agent Steven M. Reiss
- Priority: CN200710203331 20071221
- Main IPC: E05D11/00
- IPC: E05D11/00
Abstract:
A hinge assembly (26) includes a first hinge shoulder (262), a second hinge shoulder (264), a hinge sleeve positioned (266) between the first hinge shoulder and the second hinge shoulder, a hinge (268) pivotably connecting the first hinge shoulder to the hinge sleeve, and a ceramic bushing (269) pivotably connecting the second hinge shoulder to the hinge sleeve.
Public/Granted literature
- US20090158555A1 HINGE ASSEMBLY AND FOLDABLE ELECTRONIC DEVICE USING THE SAME Public/Granted day:2009-06-25
Information query
