Invention Grant
- Patent Title: Liquid ejection head and method of manufacturing the same
- Patent Title (中): 液体喷射头及其制造方法
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Application No.: US11194461Application Date: 2005-08-02
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Publication No.: US07681995B2Publication Date: 2010-03-23
- Inventor: Yasuhisa Kaneko
- Applicant: Yasuhisa Kaneko
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2004-225324 20040802
- Main IPC: B41J2/05
- IPC: B41J2/05

Abstract:
A liquid ejection head for an electrostatic ink jet including an insulating ejection substrate in which through holes are bored to form ejection openings for ejecting droplets; an insulating support substrate arranged while facing the ejection substrate with a predetermined distance therebetween; a solution flow path provided between the ejection substrate and the support substrate; ejection electrodes, respectively provided corresponding to the through holes, for exerting electrostatic forces on the solution; and a shield electrode, provided corresponding to at least one of the through holes on a solution ejection side with respect to the ejection electrodes, for preventing electric field interferences between the through holes. Plural flow path wall portions contacting the ejection substrate stands in the solution flow path, and at least one of electrode lines connected to the ejection electrodes and electrode lines connected to the shield electrode are contained in the flow path wall portions.
Public/Granted literature
- US20060023030A1 Liquid ejection head and method of manufacturing the same Public/Granted day:2006-02-02
Information query
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