Invention Grant
- Patent Title: Backlight module with a heat dissipation device
- Patent Title (中): 具有散热装置的背光模组
-
Application No.: US11851391Application Date: 2007-09-07
-
Publication No.: US07682047B2Publication Date: 2010-03-23
- Inventor: Nien-Hui Hsu , Ching-Po Lee
- Applicant: Nien-Hui Hsu , Ching-Po Lee
- Applicant Address: TW Hsinchu
- Assignee: Coretronic Corporation
- Current Assignee: Coretronic Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW95139970A 20061030
- Main IPC: F21V29/00
- IPC: F21V29/00

Abstract:
A backlight module including a light box, a plurality of light source sets, and a heat dissipation device is provided. The light box has a bottom and a light-emitting section. The bottom has a first surface and a second surface opposite to the first surface. The light source sets are disposed on the first surface, and each of the light source sets includes a substrate disposed on the first surface and a plurality of point light sources disposed on the substrate. The heat dissipation device is disposed on the second surface. The heat dissipation device includes a thermal assembly and at least one fan, and the thermal assembly includes a plurality of covers. Each of the covers is individually disposed on the second surface at a position below one of the light source sets, and an air flow channel is formed between each cover and the bottom.
Public/Granted literature
- US20080101065A1 BACKLIGHT MODULE Public/Granted day:2008-05-01
Information query