A device for applying a cleaning or polishing solution to a surface and wiping the solution over the surface includes a rotatable valve that allows for the dispensing of the solution through either a nozzle that sprays the solution in front of a disposable sponge-like pad secured to the device, or directly into the pad for application to the surface by the pad. The device also includes a rearward opening that releasably receives a container of the solution to be dispensed from the device. When the container is empty, the container is removed and replaced in order to allow the device to be used in a generally continuous manner for cleaning and polishing the surface. The disposable pad connected to the device may also include a cleaning surface capable of picking up dust, dirt and other debris in addition to applying the polishing and cleaning solutions to the surface.