Invention Grant
- Patent Title: Molding manufacturing method and apparatus
- Patent Title (中): 成型制造方法和装置
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Application No.: US12219022Application Date: 2008-07-15
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Publication No.: US07682146B2Publication Date: 2010-03-23
- Inventor: Yoshikazu Miwa , Akira Jinno , Masahito Yamada , Junichi Miyake , Tatsuya Tamura
- Applicant: Yoshikazu Miwa , Akira Jinno , Masahito Yamada , Junichi Miyake , Tatsuya Tamura
- Applicant Address: JP Aichi
- Assignee: Tokai Kogyo Co., Ltd.
- Current Assignee: Tokai Kogyo Co., Ltd.
- Current Assignee Address: JP Aichi
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2002-342648 20021126; JP2002-342649 20021126; JP2002-365393 20021217
- Main IPC: B29C53/02
- IPC: B29C53/02 ; B29C53/48

Abstract:
A molding manufacturing method includes: preparing a molding body including a molding main body made of thermoplastic material and a decorative layer higher than the molding main body in hardness and melt temperature; setting the molding body in a fixed die; heating and softening an end portion of the molding body while maintaining the decorative layer softer than the molding main body, by irradiating an infrared ray onto a back surface of the molding main body corresponding to the end portion; and press forming the end portion of the molding body by applying a movable punch onto the fixed die while the end portion of the molding body is in a softened state to bend the end portion of the molding body to obtain an end cover portion having a predetermined shape.
Public/Granted literature
- US20080286395A1 Molding manufacturing method and apparatus Public/Granted day:2008-11-20
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