A Land Grid Array connector (1) comprises an socket (2) having opposite upper and lower surfaces, a plurality of contacts (4) received in the socket and a retention frame (3) assembled with the socket. Each contact comprises upper and lower contacting sections (41, 42) extending beyond the upper and lower surfaces of the socket adapted for electrically connecting with a Central Processing Unit and Printed Circuit Board. The retention frame comprises a base portion (31) defining an opening to interferentially receive the outer periphery of the socket and four sidewalls (32) extending upwardly beyond the base portion. The socket fills up the opening after assembled to the retention frame and forms a receiving space together with the base portion and the four sidewalls of the retention frame which is originally communicating with the opening before the socket is assembled to the retention frame adapted for accommodating the Central Processing Unit.