Invention Grant
- Patent Title: Electronic device with grounding mechanism
- Patent Title (中): 带接地机构的电子设备
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Application No.: US11959258Application Date: 2007-12-18
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Publication No.: US07682166B2Publication Date: 2010-03-23
- Inventor: Cheng-Lung Chang
- Applicant: Cheng-Lung Chang
- Applicant Address: TW Tu-Cheng, Taipei County
- Assignee: Chi Mei Communication Systems, Inc.
- Current Assignee: Chi Mei Communication Systems, Inc.
- Current Assignee Address: TW Tu-Cheng, Taipei County
- Agent Steven M. Reiss
- Priority: CN200710201482 20070828
- Main IPC: H01R4/66
- IPC: H01R4/66
Abstract:
A grounding mechanism (20) is electronically connected to a main circuit board (52), a subsidiary circuit board (53) and a key conductive member (55). The grounding mechanism includes an elastic member (30). The elastic member includes a mounting portion (31), a conductive portion (32) and a resisting portion (35). The mounting portion is electronically fixed to the main circuit board. The conductive portion extends from one side of the mounting portion for electronically connecting to the key conductive member. The resisting portion extends from another side of the mounting portion for resisting the subsidiary circuit board.
Public/Granted literature
- US20090061663A1 ELECTRONIC DEVICE WITH GROUNDING MECHANISM Public/Granted day:2009-03-05
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