Invention Grant
- Patent Title: Integrated endpoint detection system with optical and eddy current monitoring
- Patent Title (中): 具有光学和涡流监测的集成端点检测系统
-
Application No.: US11677450Application Date: 2007-02-21
-
Publication No.: US07682221B2Publication Date: 2010-03-23
- Inventor: Boguslaw A. Swedek , Manoocher Birang , Nils Johansson
- Applicant: Boguslaw A. Swedek , Manoocher Birang , Nils Johansson
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Fish & Richardson PC
- Main IPC: B24B49/00
- IPC: B24B49/00 ; B24B29/00 ; G01R33/12 ; G01B7/06 ; G06F19/00 ; B24B37/04 ; G01L21/00
Abstract:
A chemical mechanical polishing apparatus and method can use an eddy current monitoring system and an optical monitoring system. Signals from the monitoring systems can be combined on an output line and extracted by a computer. A thickness of a polishing pad can be calculated. The eddy current monitoring system and optical monitoring system can measure substantially the same location on the substrate.
Public/Granted literature
- US20070135958A1 INTEGRATED ENDPOINT DETECTION SYSTEM WITH OPTICAL AND EDDY CURRENT MONITORING Public/Granted day:2007-06-14
Information query
