Invention Grant
- Patent Title: Method for repair of a spine and intervertebral implant
- Patent Title (中): 修复脊柱和椎间植入物的方法
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Application No.: US11448992Application Date: 2006-06-08
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Publication No.: US07682394B2Publication Date: 2010-03-23
- Inventor: Didier Recoules-Arche , Robert Velez , Robert Lange
- Applicant: Didier Recoules-Arche , Robert Velez , Robert Lange
- Applicant Address: CH Zurich
- Assignee: Co-Ligne AG
- Current Assignee: Co-Ligne AG
- Current Assignee Address: CH Zurich
- Agency: Browdy & Neimark, PLLC
- Main IPC: A61F2/44
- IPC: A61F2/44

Abstract:
Repair of a spine from a posterior approach especially for locating an implant between a lower and upper human vertebra includes making an incision in the skin lateral to the midline, making an incision through the Erector Spinae Aponeurosis (ESA) following the ELIF groove, separating the ESA from the Longissimus Thoracis Pars Lumborum (LTPL), atraumatic separating the Multifidus from the LTPL using the interfascial boundary between the Multifidus and the LTPL, and creating a surgical plane having an angle of 20°-60°.
Public/Granted literature
- US20070016298A1 Method for repair of a spine and intervertebral implant Public/Granted day:2007-01-18
Information query
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