Invention Grant
- Patent Title: Plating solutions for electroless deposition of ruthenium
- Patent Title (中): 用于钌无电沉积的电镀溶液
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Application No.: US12269857Application Date: 2008-11-12
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Publication No.: US07682431B1Publication Date: 2010-03-23
- Inventor: Albina Zieliene , Algirdas Vaskelis , Eugenijus Norkus
- Applicant: Albina Zieliene , Algirdas Vaskelis , Eugenijus Norkus
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: Martine Penilla & Gencarella, LLP
- Main IPC: C23C18/44
- IPC: C23C18/44
Abstract:
An electroless ruthenium plating solution is disclosed herein. The solution includes a ruthenium source, a polyamino polycarboxylic acid complexing agent, a reducing agent, a stabilizing agent, and a pH-modifying substance. A method of preparing an electroless ruthenium plating solution is also provided.
Information query
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