Invention Grant
- Patent Title: Adhesion promotion in printed circuit boards
- Patent Title (中): 印刷电路板中的粘附促进
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Application No.: US11759456Application Date: 2007-06-07
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Publication No.: US07682432B2Publication Date: 2010-03-23
- Inventor: Abayomi I. Owei , Hiep X. Nguyen , Eric Yakobson
- Applicant: Abayomi I. Owei , Hiep X. Nguyen , Eric Yakobson
- Applicant Address: US CT West Haven
- Assignee: Enthone Inc.
- Current Assignee: Enthone Inc.
- Current Assignee Address: US CT West Haven
- Agency: Senniger Powers LLP
- Main IPC: C23C22/00
- IPC: C23C22/00 ; C23C22/05 ; C23C22/52 ; C23C22/63 ; C23F11/00
Abstract:
An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is effective to increase copper-loading in the composition.
Public/Granted literature
- US20070228333A1 ADHESION PROMOTION IN PRINTED CIRCUIT BOARDS Public/Granted day:2007-10-04
Information query
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