Invention Grant
- Patent Title: Pressure-sensitive adhesive product
- Patent Title (中): 压敏胶产品
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Application No.: US11329046Application Date: 2006-01-11
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Publication No.: US07682692B2Publication Date: 2010-03-23
- Inventor: Tsuneyuki Amano , Takashi Imoto
- Applicant: Tsuneyuki Amano , Takashi Imoto
- Applicant Address: JP Ibaraki-shi, Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Ibaraki-shi, Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JPP.2005-005967 20050113
- Main IPC: B32B7/12
- IPC: B32B7/12

Abstract:
A pressure-sensitive adhesive product contains a substrate having formed on at least one surface thereof a pressure-sensitive adhesive layer, wherein the substrate is formed from a styrene-based resin composition and the pressure-sensitive adhesive layer is formed from an acrylic pressure-sensitive adhesive containing an acrylic polymer, a liquid paraffin, and a rosin-based tackifying resin. In the acrylic pressure-sensitive adhesive, the ratio of the liquid paraffin is preferably 6 to 50 parts by weight based on 100 parts by weight of the acrylic polymer and the ratio of the rosin-based tackifying resin is preferably 1 to 30 parts by weight based on 100 parts by weight of the acrylic polymer. The liquid paraffin may have a number-average molecular weight of 300 to 500 and may have a dynamic viscosity at 37.8° C. of 6 to 80 mm2/second.
Public/Granted literature
- US20060154097A1 Pressure-sensitive adhesive product Public/Granted day:2006-07-13
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