Invention Grant
- Patent Title: Resist composition and method for forming resist pattern
- Patent Title (中): 抗蚀剂组合物和形成抗蚀剂图案的方法
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Application No.: US10576405Application Date: 2004-10-20
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Publication No.: US07682770B2Publication Date: 2010-03-23
- Inventor: Hideo Hada , Masaru Takeshita , Ryotaro Hayashi , Syogo Matsumaru , Taku Hirayama , Hiroaki Shimizu
- Applicant: Hideo Hada , Masaru Takeshita , Ryotaro Hayashi , Syogo Matsumaru , Taku Hirayama , Hiroaki Shimizu
- Applicant Address: JP Kawasaki-shi
- Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee Address: JP Kawasaki-shi
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Priority: JP2003-363521 20031023; JP2003-410489 20031209; JP2004-057448 20040302
- International Application: PCT/JP2004/015504 WO 20041020
- International Announcement: WO2005/040922 WO 20050506
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/028

Abstract:
A resist composition is provided that yields fine resolution, and improved levels of line edge roughness and depth of focus. This composition includes a resin component (A) that undergoes a change in alkali solubility under the action of acid, and an acid generator component (B) that generates acid on exposure, wherein the component (A) is a resin with a weight average molecular weight of no more than 8,000 containing structural units (a) derived from a (meth)acrylate ester, and the component (B) includes at least one sulfonium compound represented by a general formula (b-1) or a general formula (b-2) shown below.
Public/Granted literature
- US20070275307A1 Resist Composition and Method for Forming Resist Pattern Public/Granted day:2007-11-29
Information query
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