Invention Grant
- Patent Title: Method of manufacturing semiconductor laser device including light shield plate
- Patent Title (中): 制造包括遮光板的半导体激光装置的方法
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Application No.: US11889121Application Date: 2007-08-09
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Publication No.: US07682852B2Publication Date: 2010-03-23
- Inventor: Han-youl Ryu , Kyoung-ho Ha , Youn-joon Sung
- Applicant: Han-youl Ryu , Kyoung-ho Ha , Youn-joon Sung
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Led Co., Ltd.
- Current Assignee: Samsung Led Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2006-0105042 20061027
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
Provided is a method of manufacturing a semiconductor laser device having a light shield film comprising: forming a light emission structure by depositing a first clad layer, an active layer and a second clad layer on a substrate; depositing a light shield film and a protection film on the light emission face of the light emission structure; removing the light shield film corresponding to an area of the light emission face of the light emission structure including and above the first clad layer; and removing the protection layer.
Public/Granted literature
- US20080102546A1 Method of manufacturing semiconductor laser device including light shield plate Public/Granted day:2008-05-01
Information query
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