Invention Grant
- Patent Title: Protection capsule for MEMS devices
- Patent Title (中): MEMS器件保护胶囊
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Application No.: US11687287Application Date: 2007-03-16
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Publication No.: US07682860B2Publication Date: 2010-03-23
- Inventor: Luc Ouellet , Veronique Giard , Sylvie Archambault , Paul Ignatiuk
- Applicant: Luc Ouellet , Veronique Giard , Sylvie Archambault , Paul Ignatiuk
- Applicant Address: CA Waterloo, ON
- Assignee: DALSA Semiconductor Inc.
- Current Assignee: DALSA Semiconductor Inc.
- Current Assignee Address: CA Waterloo, ON
- Agency: Marks & Clerk
- Agent Richard J. Mitchell
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method of making a MEMS device is disclosed wherein anhydrous HF exposed silicon nitride is used as a temporary adhesion layer to permit the transfer of a layer from a carrier substrate to a receiving substrate.
Public/Granted literature
- US20070231943A1 PROTECTION CAPSULE FOR MEMS DEVICES Public/Granted day:2007-10-04
Information query
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