Invention Grant
- Patent Title: Image sensor and method for manufacturing the same
- Patent Title (中): 图像传感器及其制造方法
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Application No.: US11957217Application Date: 2007-12-14
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Publication No.: US07682862B2Publication Date: 2010-03-23
- Inventor: Jeong-Su Park
- Applicant: Jeong-Su Park
- Applicant Address: KR Seoul
- Assignee: Dongbu HiTek Co., Ltd.
- Current Assignee: Dongbu HiTek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Sherr & Vaughn PLLC
- Priority: KR10-2006-0134235 20061226
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method for manufacturing an image sensor that can include forming a pad electrode over a semiconductor substrate; forming a protective layer over the pad electrode; forming a via hole through the protective layer to expose a portion of the uppermost surface of the pad electrode; and then forming a gold layer over the exposed portion of the uppermost surface of the pad electrode.
Public/Granted literature
- US20080150058A1 IMAGE SENSOR AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2008-06-26
Information query
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