Invention Grant
- Patent Title: Encapsulation circuitry on a substrate
- Patent Title (中): 衬底上的封装电路
-
Application No.: US11877408Application Date: 2007-10-23
-
Publication No.: US07682878B2Publication Date: 2010-03-23
- Inventor: David A. Ruben , Scott B. Sleeper , Peter C. Tortorici
- Applicant: David A. Ruben , Scott B. Sleeper , Peter C. Tortorici
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agent Carol F. Barry
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
An assembly for a circuit board includes a substrate, at least one circuit component formed on the substrate, and a frame. The frame comprises a first substantially planar surface attached to the substrate, and a hole formed through the frame and defined by a wall that surrounds the at least one circuit component. A method of manufacturing the circuit board includes the step of attaching the substantially planar surface of the frame to the substrate in an arrangement in which the at least one circuit component is surrounded by a wall that defines the hole.
Public/Granted literature
- US20080038878A1 ENCAPSULATION CIRCUITRY ON A SUBSTRATE Public/Granted day:2008-02-14
Information query
IPC分类:
