Invention Grant
US07682920B2 Method for making a p-i-n diode crystallized adjacent to a silicide in series with a dielectric antifuse
有权
制造与绝缘反熔丝串联的硅化物附近的p-i-n二极管的方法
- Patent Title: Method for making a p-i-n diode crystallized adjacent to a silicide in series with a dielectric antifuse
- Patent Title (中): 制造与绝缘反熔丝串联的硅化物附近的p-i-n二极管的方法
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Application No.: US11560283Application Date: 2006-11-15
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Publication No.: US07682920B2Publication Date: 2010-03-23
- Inventor: S. Brad Herner
- Applicant: S. Brad Herner
- Applicant Address: US CA Milpitas
- Assignee: Sandisk 3D LLC
- Current Assignee: Sandisk 3D LLC
- Current Assignee Address: US CA Milpitas
- Agency: Dugan & Dugan, PC
- Main IPC: H01L21/331
- IPC: H01L21/331

Abstract:
A method is described for forming a nonvolatile one-time-programmable memory cell having reduced programming voltage. A contiguous p-i-n diode is paired with a dielectric rupture antifuse formed of a high-dielectric-constant material, having a dielectric constant greater than about 8. In preferred embodiments, the high-dielectric-constant material is formed by atomic layer deposition. The diode is preferably formed of deposited low-defect semiconductor material, crystallized in contact with a silicide. A monolithic three dimensional memory array of such cells can be formed in stacked memory levels above the wafer substrate.
Public/Granted literature
- US20070087508A1 METHOD FOR MAKING A P-I-N DIODE CRYSTALLIZED ADJACENT TO A SILICIDE IN SERIES WITH A DIELECTRIC ANTIFUSE Public/Granted day:2007-04-19
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