Invention Grant
US07682920B2 Method for making a p-i-n diode crystallized adjacent to a silicide in series with a dielectric antifuse 有权
制造与绝缘反熔丝串联的硅化物附近的p-i-n二极管的方法

  • Patent Title: Method for making a p-i-n diode crystallized adjacent to a silicide in series with a dielectric antifuse
  • Patent Title (中): 制造与绝缘反熔丝串联的硅化物附近的p-i-n二极管的方法
  • Application No.: US11560283
    Application Date: 2006-11-15
  • Publication No.: US07682920B2
    Publication Date: 2010-03-23
  • Inventor: S. Brad Herner
  • Applicant: S. Brad Herner
  • Applicant Address: US CA Milpitas
  • Assignee: Sandisk 3D LLC
  • Current Assignee: Sandisk 3D LLC
  • Current Assignee Address: US CA Milpitas
  • Agency: Dugan & Dugan, PC
  • Main IPC: H01L21/331
  • IPC: H01L21/331
Method for making a p-i-n diode crystallized adjacent to a silicide in series with a dielectric antifuse
Abstract:
A method is described for forming a nonvolatile one-time-programmable memory cell having reduced programming voltage. A contiguous p-i-n diode is paired with a dielectric rupture antifuse formed of a high-dielectric-constant material, having a dielectric constant greater than about 8. In preferred embodiments, the high-dielectric-constant material is formed by atomic layer deposition. The diode is preferably formed of deposited low-defect semiconductor material, crystallized in contact with a silicide. A monolithic three dimensional memory array of such cells can be formed in stacked memory levels above the wafer substrate.
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