Invention Grant
US07682939B2 Method for the preparation of group IB-IIIA-VIA quaternary or higher alloy semiconductor films 有权
IB-IIIA-VIA族四元以上合金半导体膜的制备方法

  • Patent Title: Method for the preparation of group IB-IIIA-VIA quaternary or higher alloy semiconductor films
  • Patent Title (中): IB-IIIA-VIA族四元以上合金半导体膜的制备方法
  • Application No.: US10568227
    Application Date: 2004-08-13
  • Publication No.: US07682939B2
    Publication Date: 2010-03-23
  • Inventor: Vivian Alberts
  • Applicant: Vivian Alberts
  • Applicant Address: ZA Johannesburg
  • Assignee: University of Johannesburg
  • Current Assignee: University of Johannesburg
  • Current Assignee Address: ZA Johannesburg
  • Agency: Knobbe Martens Olson & Bear LLP
  • Priority: ZA2003/6316 20030814; ZA2004/2497 20040330
  • International Application: PCT/IB2004/051458 WO 20040813
  • International Announcement: WO2005/017978 WO 20050224
  • Main IPC: H01L29/93
  • IPC: H01L29/93
Method for the preparation of group IB-IIIA-VIA quaternary or higher alloy semiconductor films
Abstract:
This invention relates to a method for producing group IB-IIA-VIA quaternary or higher alloy semiconductor films wherein the method comprises the steps of (i) providing a metal film comprising a mixture of group IB and group IIIA metals; (ii) heat treating the metal film in the presence of a source of a first group VIA element (said first group VIA element hereinafter being referred to as VIA1) under conditions to form a first film comprising a mixture of at least one binary alloy selected from the group consisting of a group IB-VIA1 alloy and a group IIIA-VIA1 alloy and at least one group IB-IIIA-VIA1 ternary alloy (iii) optionally heat treating the first film in the presence of a source of a second group VIA element (said second group VI element hereinafter being referred to as VIA2) under conditions to convert the first film into a second film comprising at least one alloy selected from the group consisting of a group IB-VIA1-VIA2 alloy and a group IIIA-VIA1-VIA2 alloy; and the at least one group IB-III-VIA1 ternary alloy of step (ii); (iv) heat treating either the first film or second film to form a group IB-IIIA-VIA quaternary or higher alloy semiconductor film.
Information query
IPC分类:
H 电学
H01 基本电气元件
H01L 半导体器件;其他类目中不包括的电固体器件(使用半导体器件的测量入G01;一般电阻器入H01C;磁体、电感器、变压器入H01F;一般电容器入H01G;电解型器件入H01G9/00;电池组、蓄电池入H01M;波导管、谐振器或波导型线路入H01P;线路连接器、汇流器入H01R;受激发射器件入H01S;机电谐振器入H03H;扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R;一般电光源入H05B;印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K;在具有特殊应用的电路中使用的半导体器件见应用相关的小类)
H01L29/00 专门适用于整流、放大、振荡或切换,并具有至少一个电位跃变势垒或表面势垒的半导体器件;具有至少一个电位跃变势垒或表面势垒,例如PN结耗尽层或载流子集结层的电容器或电阻器;半导体本体或其电极的零部件(H01L31/00至H01L47/00,H01L51/05优先;除半导体或其电极之外的零部件入H01L23/00;由在一个共用衬底内或其上形成的多个固态组件组成的器件入H01L27/00)
H01L29/66 .按半导体器件的类型区分的
H01L29/86 ..只能通过对一个或多个通有待整流,放大、振荡或切换的电流的电极供给电流的变化或施加电位的变化方可进行控制的(H01L29/96优先)
H01L29/92 ...有电位跃变势垒或表面势垒的电容器
H01L29/93 ....电容量可变的二极管,例如变容二极管
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