Invention Grant
- Patent Title: Method of forming p-type compound semiconductor layer
- Patent Title (中): 形成p型化合物半导体层的方法
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Application No.: US12090305Application Date: 2007-06-29
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Publication No.: US07682953B2Publication Date: 2010-03-23
- Inventor: Ki Bum Nam , Hwa Mok Kim , James S. Speck
- Applicant: Ki Bum Nam , Hwa Mok Kim , James S. Speck
- Applicant Address: KR Ansan-si
- Assignee: Seoul Opto Device Co., Ltd.
- Current Assignee: Seoul Opto Device Co., Ltd.
- Current Assignee Address: KR Ansan-si
- Agency: H.C. Park & Associates, PLC
- Priority: KR10-2006-0060820 20060630; KR10-2006-0060822 20060630
- International Application: PCT/KR2007/003185 WO 20070629
- International Announcement: WO2008/002104 WO 20080103
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A method of forming a p-type compound semiconductor layer includes increasing a temperature of a substrate loaded into a reaction chamber to a first temperature. A source gas of a Group III element, a source gas of a p-type impurity, and a source gas of nitrogen containing hydrogen are supplied into the reaction chamber to grow the p-type compound semiconductor layer. Then, the supply of the source gas of the Group III element and the source gas of the p-type impurity is stopped and the temperature of the substrate is lowered to a second temperature. The supply of the source gas of nitrogen containing hydrogen is stopped and drawn out at the second temperature, and the temperature of the substrate is lowered to room temperature using a cooling gas. Accordingly, hydrogen is prevented from bonding to the p-type impurity in the p-type compound semiconductor layer.
Public/Granted literature
- US20090163002A1 METHOD OF FORMING P-TYPE COMPOUND SEMICONDUCTOR LAYER Public/Granted day:2009-06-25
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