Invention Grant
- Patent Title: Dental polymerizable composition
- Patent Title (中): 牙科可聚合组合物
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Application No.: US11659811Application Date: 2005-08-11
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Publication No.: US07683103B2Publication Date: 2010-03-23
- Inventor: Hideo Sawada , Junji Tagami , Toru Nikaido , Khairul Matin , Yoshinori Kadoma , Eiichi Masuhara , Koichi Okada , Junichi Yamauchi
- Applicant: Hideo Sawada , Junji Tagami , Toru Nikaido , Khairul Matin , Yoshinori Kadoma , Eiichi Masuhara , Koichi Okada , Junichi Yamauchi
- Applicant Address: JP Kurashiki-shi
- Assignee: Kuraray Medical Inc.
- Current Assignee: Kuraray Medical Inc.
- Current Assignee Address: JP Kurashiki-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2004-234622 20040811
- International Application: PCT/JP2005/014744 WO 20050811
- International Announcement: WO2006/016649 WO 20060216
- Main IPC: A61K6/00
- IPC: A61K6/00

Abstract:
A dental polymerizable composition comprising (a) a fluorine compound comprising a chain polymer having a main chain comprising a monomer unit having a hydrophilic group, and terminal groups comprising a fluoroalkyl group at each of both ends of the main chain; (b) a polymerizable monomer; and (c) a polymerization initiator. The dental polymerizable composition can be suitably used, for example, for dental composite resins, such as dental composite filler materials, crowning materials, and bonding materials; dental adhesive agents, such as teeth-straightening adhesive agents, cavity-coating adhesive agents, and tooth fissure sealing materials; denture base materials, denture base mucosal adjusting materials, fissure sealants, coating agents applied to tooth surface or dental prosthetic, surface glazes, and the like, and especially for various coating applications, for example, a fissure sealant, a coating agent to tooth surface or dental prosthetic, surface stains or a surface glaze, a hypersensitive inhibitor, a dental manicure, or the like.
Public/Granted literature
- US20080039592A1 Dental Polymerizable Composition Public/Granted day:2008-02-14
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