A method and associated assembly is provided for a collapsible EMC gasket is provided. In one embodiment, the gasket comprises a flexible conductive sheet disposed between corner of a first and a second surface of a computer frame capable of housing electronic components. The sheet is larger in area than the corner area of the frame such that when disposed, said sheet forms a curved structure. The sheet is being fabricated of a material that can be compressed and then decompressed back to its original shape.